| Dynatex International |
Dynatex International is the leader in dry process dicing and wafer dicing materials. We are committed to provide solutions for die/diode
dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator
intervention. With over four decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to
assist you with your specific product requirements.
dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator
intervention. With over four decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to
assist you with your specific product requirements.
DTX-200-ADB
This state of the art diamond scribe and break machine is the next generation in
singulation. It combines both the scribe and break mechanisms into one machine as an
efficient package for the clean room.
This state of the art diamond scribe and break machine is the next generation in
singulation. It combines both the scribe and break mechanisms into one machine as an
efficient package for the clean room.
| For more information, please visit http://dynatex.com |
| SOLUTIONS FOR THE ELECTRONICS INDUSTRY |
