Dynatex International is the leader in dry process dicing and wafer dicing materials. We are committed to provide solutions for die/diode
dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator
intervention. With over four decades of experience, Dynatex offers a strong base of technical accomplishment and business expertise to
assist you with your specific product requirements.
GST Scriber / Breaker
The GST equipment is automated using a Windows™ NT interface, ensuring
consistency and speed. Once the test wafer or laser bar is calibrated, production wafers
move quickly through the process with little production support. Within seconds of
proper alignment, the GST processes the wafer or laser bar and is ready for more in a
24/7 production environment.
SOLUTIONS FOR THE ELECTRONICS INDUSTRY
|
