SST International is widely recognized as an innovative leader in the development and application of microelectronic package assembly
equipment and technology. For over twenty-five years, SST has provided flux-free and void-free soldering, brazing and glass sealing
solutions to the world-wide electronics industry. SST’s team of leading engineers and technologists are constantly advancing the state-of-
the-art in microelectronic package assembly techniques, processes and equipment.
Model 1200
The Model 1200 Table-Top Vacuum Solder Reflow Station has been designed for
process development and low volume production of Flux-Free and Void-Free
soldered joints in microelectronic packages and components. The station is easy to
use and profile for a wide variety of soldering tasks. A ramping temperature
controller is combined with customized PLC’s to provide automatic process control.
SOLUTIONS FOR THE ELECTRONICS INDUSTRY
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