Sikama

SIKAMA's innovative line of reflow soldering systems includes both straight conduction systems and SIKAMA's patented
Conduction+Convection furnaces. Our conduction technology keeps the heat where it belongs in reflow, on the bottom side of the
components. Taking reflow soldering technology a step further, SIKAMA has pioneered and patented Conduction+Convection reflow
systems. We have combined our proven conduction heat transfer technology with top side convection via a heat manifold to hold
edge-to-edge temperature variations to a minimum.

Falcon Ultra Profile 2000
SIKAMA's seven-zone Ultra Profile 2000 features their patented Conduction+Convection
technology, combined with a cooled loading platform, four Conduction+Convection heat
zones, a top and bottom liquid-cooled zone, and a liquid-cooled offload platform. Inert gas
(air, nitrogen, or forming gas) surrounds the components from the top and bottom, then
exits at the sides to prevent contamination of adjoining zones and eliminating flux buildup.