Die Attach

MicroAssembly Technologies MicroAssembly Technologies 
MAT specializes in complex, high value die bond applications such as Multi Chip Modules, Imaging devices, Sensors, MEMS devices, Flip Chip including Adhesive based and/or Eutectic processes.
http://www.mat-ltd.com
TPT  
TPT
TPT designs and manufactures a complete range of manual and semi automatic wire bonder machines with the goal to provide the highest quality wire bonding equipment. NOTE: The system can also be configured as a die bonder.
http://www.tpt-wirebonder.com/en/start.html